Wetting-induced porosity gradient formation in Cu nanoparticle sintering bonding
DOI: 10.1016/j.apsusc.2026.165823
论文
论文成果
按年份整理的代表性论文与学术成果。
Thickness design guideline for precise laser-flash analysis of effective thermal conductivity of sintered silver
DOI: 10.1016/j.icheatmasstransfer.2026.111673
Research on Titanium⁃Based Ultra⁃Thin Vapor Chamber Enhanced by Ultrafast Laser In⁃Situ Deposition (Invited)
DOI: 10.3788/cjl251558
Nanocrystalline-accelerated grain boundary diffusion creep for enhanced densification rate of nano-Cu sintering
DOI: 10.1016/j.scriptamat.2025.117142
Low-temperature nano-Ag bonding below 150 °C via reductive surface activation of an organic-free film
DOI: 10.1016/j.apsusc.2026.166834
Lattice Boltzmann modeling of flow and heat transfer in vapor chambers with implications for ultra-thin designs
DOI: 10.1016/j.applthermaleng.2026.131655
Large-area sintering of nano-copper for power module packaging and thermal-shock reliability
DOI: 10.1016/j.apmt.2025.103065
In-situ observation of hole-shape evolution and hole-wall bending suppression in water-assisted ultrafast laser drilling
DOI: 10.1016/j.optlastec.2026.115889
High-Reliability Cu-Cu3Sn Composite Bonding for Power Electronics in Harsh Environments
DOI: 10.1007/s11664-026-12883-1
Enhancing the pressure balance ability of the buffer film in large-area sintering bonding
DOI: 10.1016/j.mssp.2026.110915
Dual-mode 0D/2D spatial asymmetry optoelectronic device enabled by in situ microzone femtosecond laser deposition
DOI: 10.1038/s41377-026-02195-8
Capillary behavior of V-shape microgroove for vapor chamber fabricated by DOE-assisted femtosecond laser processing
DOI: 10.2351/7.0001970
Bioinspired Dual-Scale Crack Manipulation Enabling 325%-Stretchable Metal Film Conductors for AI-Empowered Electronic Skins
DOI: 10.1007/s40820-026-02152-5
A Self-Powered Polarization-Sensitive Neuromorphic Vision Device Enabled by Laser-Induced Symmetry Engineering
DOI: 10.1021/acsnano.5c19524
Application Challenges and Research Progress of Copper Sintering for Power Module Packaging
DOI: 10.3901/jme.260041
Transferring Fine-Pitch Cu Nanoparticle Bumps for Low-Temperature Cu-Cu Bonding in Chip-Scale Integration
DOI: 10.1109/tcpmt.2025.3540019
The Pressure Balance Effect of the Polytetrafluoroethylene Buffer Film in Pressure-Assisted Sintering Bonding
DOI: 10.1109/tcpmt.2025.3587762
Shape Synergy of Ag@Cu Chip Packaging Nano-Paste and Its Sintering Reliability
DOI: 10.1002/adem.202401906
Robust Neuromorphic Computing Enabled by Femtosecond Laser-Modulated Divergent Ion Dynamics in CuInP2S6
DOI: 10.1002/adfm.202504334
Research on ultrasonic-assisted vibration multi-cycle compaction method of flexible guided 3D weaving
DOI: 10.1016/j.ultras.2024.107461
Rapid in-situ formation of Cu-Sn full intermetallic compound films and their joint strengthening mechanisms
DOI: 10.1016/j.matdes.2025.114241
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere
DOI: 10.1016/j.microrel.2025.115863
Influence of aging atmosphere on the thermal stability of low-temperature sintered Cu joints based on Cu nanoparticles
DOI: 10.1007/s10854-025-15039-9
High⁃Throughput Helical Drilling of Shaped Micro⁃Hole Arrays with Multi⁃Beam Ultrafast Laser
DOI: 10.3788/cjl241076
High-efficiency fabrication of high-performance Al wicks via hybrid laser-etching processing
DOI: 10.1016/j.icheatmasstransfer.2025.109620
Extending low-temperature sintering technique to large-sized whole-wafer power semi-conductor devices
DOI: 10.1049/hve2.12525
Decoupling capillary force-viscous resistance trade-off by shape-gradient microgrooves wick design
DOI: 10.1063/5.0276112
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
DOI: 10.1007/s11664-024-10970-9
Review on Power Cycling Reliability of SiC Power Device
DOI: 10.3390/electronicmat5020007
Research Progress of Cu Nanoparticle Sintering Technology for Power Electronic Packaging
DOI: 10.12442/j.issn.1002-185X.20230170
Research Progress in Preparation and Reliability of Cu-Sn Full IMC Joints for Power Device Packaging
DOI: 10.13234/j.issn.2095-2805.2024.3.62
Research Progresses on Incremental EMF Technology for Thin-walled Components
DOI: 10.3969/j.issn.1004-132x.2024.12.001
Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging
DOI: 10.2351/7.0001321
Polarization-dependent, beam reflection-regulated hole shaping dynamics visualized by in-situ imaging of ultrafast laser drilling process
DOI: 10.1016/j.precisioneng.2023.11.010
Particle Size Effects of Nano-Ag Films on the Interface Sintered Bonding for Die Attachment
DOI: 10.1007/s11664-023-10786-z
Optimized bimodal silver particle sintering for high thermal conductivity die-attach layers
DOI: 10.1016/j.matlet.2024.137467
MoS2/ZnO-heterostructured optoelectronic synapse for multiwavelength optical information-based sensing, memory, and processing
DOI: 10.1016/j.nanoen.2024.109733
Local modulation of Au/MoS2 Schottky barriers using a top ZnO nanowire gate for high-performance photodetection
DOI: 10.1039/d3nh00448a
Interfacial bonding mechanisms of sintered Cu nanoparticles on different metallization surfaces
DOI: 10.1016/j.surfin.2024.104173
Improving thermal stability and reliability of power chips by sintering foam structure layer
DOI: 10.1016/j.apmt.2024.102397
Improved Thermal Conductivity and Reliability Through Graphene Reinforced Nanopaste for Power Devices in New Energy Vehicles
DOI: 10.1109/tcpmt.2023.3339686
Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging
DOI: 10.1016/j.jmatprotec.2024.118438
Enhanced shear strength and microstructure of Cu-Cu interconnection by low-temperature sintering of Cu nanoparticles
DOI: 10.1007/s10854-024-12492-w
Enhanced capillary performance of multiscale ultrathin titanium wicks guided by modified wicking dynamics
DOI: 10.1016/j.ijheatmasstransfer.2023.125000
Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization
DOI: 10.1007/s11664-024-11020-0
Construction of microstructures on the Cu substrate using ultrafast laser processing to enhance the bonding strength of sintered Ag nanoparticles
DOI: 10.2351/7.0001327
Artificial Intelligence Meets Flexible Sensors: Emerging Smart Flexible Sensing Systems Driven by Machine Learning and Artificial Synapses
DOI: 10.1007/s40820-023-01235-x
Ag-Pd nanoalloy film with ultra-high thermal and electrochemical stability for power electronic packaging
DOI: 10.1016/j.mtcomm.2024.110791
Venation-Mimicking, Ultrastretchable, Room-Temperature-Attachable Metal Tapes for Integrated Electronic Skins
DOI: 10.1002/adma.202208568
The Mechanisms of Oxygen Accelerated Low-Temperature Bonding by Ag Nanoparticles
DOI: 10.1002/ppsc.202200195
The mechanism of irregular hole-shape formation during ultrafast laser micro-drilling of metals
DOI: 10.1007/s00339-022-06358-3
Switching ultra-stretchability and sensitivity in metal films for electronic skins: a pufferfish-inspired, interlayer regulation strategy
DOI: 10.1039/d3mh00252g
Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging
DOI: 10.1016/j.apsusc.2022.155663
Predicting Effective Thermal Conductivity of Sintered Silver by Microstructural-Simulation-Based Machine Learning
DOI: 10.1007/s11664-022-10172-1
Patterned Cu Nanoparticle Film for All-Cu Interconnection Without Chemical Mechanical Polishing Pretreatment
DOI: 10.1109/tcpmt.2023.3278320
Multifunctional van der Waals heterostructures enabled by femtosecond laser-controlled band alignment engineering
DOI: 10.1016/j.nanoen.2023.108548
Locally Thinned, Core-Shell Nanowire-Integrated Multi-gate MoS2 Transistors for Active Control of Extendable Logic
DOI: 10.1021/acsami.2c17788
Interface enhancing strategy for low-temperature bonding of Ag-based nanoalloy
DOI: 10.1016/j.matlet.2023.134050
High-speed directional transport of condensate droplets on superhydrophobic saw-tooth surfaces
DOI: 10.1016/j.jcis.2023.06.113
High performance 1D-2D CuO/MoS2 photodetectors enhanced by femtosecond laser-induced contact engineering
DOI: 10.1039/d2mh01088g
Highly accurate and efficient prediction of effective thermal conductivity of sintered silver based on deep learning method
DOI: 10.1016/j.ijheatmasstransfer.2022.123654
Generative AI-enabled microstructure design of porous thermal interface materials with desired effective thermal conductivity
DOI: 10.1007/s10853-023-09018-w
Deep learning driven multifeature extraction for quality evaluation of ultrafast laser drilled microhole arrays
DOI: 10.2351/7.0001162
Bonding Below 150°C Using Nano-Ag Film for Power Electronics Packaging
DOI: 10.1007/s11664-023-10358-1
Asymmetric Schottky contacts induced via localized ultrafast laser irradiation for ultrasensitive, self-powered, 2D photodetectors
DOI: 10.1016/j.nanoen.2023.108891
Analysis and modeling of the mechanical behavior of the compaction process of flexible guided 3D weaving
DOI: 10.1002/pc.27524
金属纳米材料低温键合及图形化制备研究进展
Temporal and spatial heat input regulation strategy for high-throughput micro-drilling based on multi-beam ultrafast laser
DOI: 10.1016/j.optlastec.2022.108424
Temperature dependence of the tensile and thermal fatigue cracking properties of laser-deposited cobalt-based coatings for brake disc application
DOI: 10.1016/j.msea.2022.144135
Research progress on solder thermal interface materials
DOI: 10.12073/j.cw.20211216001
Research Progress of Structured Nano Thin-films Based Micro/Nanojoining Technologies
DOI: 10.3901/jme.2022.02.017
Research progress of low-temperature Cu-Cu bonding technology for advanced packaging
DOI: 10.12073/j.hjxb.20220703003
Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging
DOI: 10.1016/j.apsusc.2022.154422
Fabrication of Metallic Superhydrophobic Surfaces with Tunable Condensate Self-Removal Capability and Excellent Anti-Frosting Performance
DOI: 10.3390/nano12203655
Boride evolutionary behavior and mechanism in the TLP repaired IN738 superalloy with crack-like defects
DOI: 10.1016/j.jallcom.2022.164692
Atomic bonding-engineered heterogeneous integration of semiconductor nanowires by femtosecond laser irradiation for a miniaturized photodetector
DOI: 10.1016/j.apsusc.2021.151709
序言
DOI: 10.3901/JME.2022.02.001
纳米银微焊点阵列的超快激光图形化沉积及其芯片封装研究
DOI: 10.3901/jme.2022.02.166
纳米颗粒材料作中间层的烧结连接及其封装应用研究进展
DOI: 10.3901/jme.2022.02.002
Thermal stress reduction strategy for high-temperature power electronics with Ag sintering
DOI: 10.1016/j.microrel.2021.114379
Solar anti-icing surface with enhanced condensate self-removing at extreme environmental conditions
DOI: 10.1073/pnas.2100978118
Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging
DOI: 10.1016/j.apsusc.2021.149579
Research Progress of Ultrafast Laser-Induced Nanowires Joining Technology
DOI: 10.3788/cjl202148.0802001
p型氧化铜纳米线的飞秒激光纳米连接
DOI: 10.3788/cjl202148.0802005
Nacre-Inspired, Liquid Metal-Based Ultrasensitive Electronic Skin by Spatially Regulated Cracking Strategy
DOI: 10.1002/adfm.202102359
Interfacial Bonding Mechanism and Mechanical Performance of Continuous Fiber Reinforced Composites in Additive Manufacturing
DOI: 10.1186/s10033-021-00538-7
Femtosecond Laser Irradiation-Mediated MoS2-Metal Contact Engineering for High-Performance Field-Effect Transistors and Photodetectors
DOI: 10.1021/acsami.1c12685
Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices
DOI: 10.1109/tcpmt.2021.3110997
Diamond thin films integrated with flexible substrates and their physical, chemical and biological characteristics
DOI: 10.1088/1361-6463/ac0de6
Bioinspired Color Switchable Photonic Crystal Silicone Elastomer Kirigami
DOI: 10.1002/anie.202103045
银微纳颗粒复合薄膜连接接头高保温组织性能演变
DOI: 10.3788/cjl202148.0802015
纳米金属颗粒焊膏低温烧结连接及其接头可靠性研究进展
DOI: 10.3788/cjl202148.0802011
飞秒激光辐照连接金属氧化物纳米线及电性能调控
DOI: 10.3788/cjl202148.0802006
超快激光旋光钻孔孔径和锥度的控制
DOI: 10.3788/cjl202148.0802017
超快激光微孔加工工艺研究进展
DOI: 10.3788/cjl202148.0802013
超快激光纳米连接及其在微纳器件制造中的应用
DOI: 10.3788/cjl202148.1502001
The high electrical and thermal conductivity of nano-Ag paste for power electronic applications
DOI: 10.1007/s40195-020-01083-3
Super black iron nanostructures with broadband ultralow reflectance for efficient photothermal conversion
DOI: 10.1016/j.apsusc.2020.146388
Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics
DOI: 10.1016/j.microrel.2020.113727
Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging
DOI: 10.1021/acsami.9b20731
Rationally designed surface microstructural features for enhanced droplet jumping and anti-frosting performance
DOI: 10.1039/d0sm00436g
Performance of Short Fiber Interlayered Reinforcement Thermoplastic Resin in Additive Manufacturing
DOI: 10.3390/ma13122868
Nanoporous silver using pulsed laser deposition for high-performance oxygen reduction reaction and hydrogen peroxide sensing
DOI: 10.1039/d0nr05395c
Moisture-Enabled Electricity Generation: From Physics and Materials to Self-Powered Applications
DOI: 10.1002/adma.202003722
Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in air
DOI: 10.1016/j.jmatprotec.2020.116823
Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics
DOI: 10.1016/j.msea.2020.139894
Maskless Patterning of Metal Outflow in Alternating Metal/Ceramic Multiple Nanolayers by Femtosecond Laser Irradiation
DOI: 10.1021/acs.jpcc.9b09884
High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial
DOI: 10.1109/tcpmt.2020.3038430
Exhaling-Driven Hydroelectric Nanogenerators for Stand-Alone Nonmechanical Breath Analyzing
DOI: 10.1002/admt.201900819
Contact engineering of single core/shell SiC/SiO2 nanowire memory unit with high current tolerance using focused femtosecond laser irradiation
DOI: 10.1039/c9nr10690a
Competing Effects between Condensation and Self-Removal of Water Droplets Determine Antifrosting Performance of Superhydrophobic Surfaces
DOI: 10.1021/acsami.9b21704
A wireless, implantable optoelectrochemical probe for optogenetic stimulation and dopamine detection
DOI: 10.1038/s41378-020-0176-9
A programmable, gradient-composition strategy producing synergistic and ultrahigh sensitivity amplification for flexible pressure sensing
DOI: 10.1016/j.nanoen.2020.104847
3D打印连续纤维复合材料丝材的成形规律
DOI: 10.3969/j.issn.1004-132x.2020.09.011
Two-photon absorption induced nanowelding for assembling ZnO nanowires with enhanced photoelectrical properties
DOI: 10.1063/1.5116242
Structure inheritance in nanoparticle ink direct-writing processes and crack-free nano-copper interconnects printed by a single-run approach
DOI: 10.3390/ma12091559
SiC chip attachment sintered by nanosilver paste and their shear strength evaluation
DOI: 10.1007/s40194-019-00736-x
Self-Powered, Rapid-Response, and Highly Flexible Humidity Sensors Based on Moisture-Dependent Voltage Generation
DOI: 10.1021/acsami.9b01523
Self-powered, flexible and remote-controlled breath monitor based on TiO2 nanowire networks
DOI: 10.1088/1361-6528/ab1b93
Rapid Ultrasonic-Assisted Soldering of AZ31B Mg Alloy/6061 Al Alloy with Low-Melting-Point Sn-xZn Solders Without Flux in Air
DOI: 10.1007/s40195-018-0749-x
Preparation of Oxidation-Resistant Ag-Cu Alloy Nanoparticles by Polyol Method for Electronic Packaging
DOI: 10.1007/s11664-018-6771-y
Plasmon-Induced Heterointerface Thinning for Schottky Barrier Modification of Core/Shell SiC/SiO2 Nanowires
DOI: 10.1021/acsami.8b20860
Near-ideal compressive strength of nanoporous silver composed of nanowires
DOI: 10.1016/j.actamat.2019.05.011
Multifunctional sensing platform with pulsed-laser-deposited silver nanoporous structures
DOI: 10.1016/j.sna.2019.04.045
Microstructural evolution and mechanical reliability of transient liquid phase sintered joint during thermal aging
DOI: 10.1007/s10853-018-2809-z
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
DOI: 10.1016/j.jallcom.2018.10.067
Low temperature Cu bonding with large tolerance of surface oxidation
DOI: 10.1063/1.5097382
Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature
DOI: 10.1007/s11664-019-07532-9
Highly focused femtosecond laser directed selective boron doping in single SiC nanowire device for n-p conversion
DOI: 10.1063/1.5115335
Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications
DOI: 10.1016/j.microrel.2019.02.002
Experimental and Theoretical Investigation of Laser Pretreatment on Strengthening the Heterojunction between Carbon Fiber-Reinforced Plastic and Aluminum Alloy
DOI: 10.1021/acsami.9b04080
Diffusion brazing repair of IN738 superalloy with crack-like defect: microstructure and tensile properties at high temperatures
DOI: 10.1080/13621718.2018.1477546
Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations
DOI: 10.1021/acsami.9b00307
A Predictive Model for Thermal Conductivity of Nano-Ag Sintered Interconnect for a SiC Die
DOI: 10.1007/s11664-019-06984-3
Ultrasonic effect mechanism on transient liquid phase bonding joints of SiCp reinforced Mg metal matrix composites using Zn-Al-Zn multi-interlayer
DOI: 10.1016/j.ultsonch.2017.11.022
Ultrasonic-assisted fluxless reactive bonding of Mg/Al dissimilar alloy using Zn-Al solder in air
DOI: 10.1080/13621718.2017.1314121
TLP repaired IN738LC superalloy with uneven surface defect gap width after post heat treatment: Microstructure and mechanical properties
DOI: 10.1016/j.jallcom.2018.02.343
Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate
DOI: 10.1016/j.jallcom.2018.07.060
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application
DOI: 10.1016/j.microrel.2018.08.004
The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications
DOI: 10.1016/j.matlet.2018.06.007
Self-Powered Wearable Electronics Based on Moisture Enabled Electricity Generation
DOI: 10.1002/adma.201705925
Scalable High-Performance Ultraminiature Graphene Micro-Supercapacitors by a Hybrid Technique Combining Direct Writing and Controllable Microdroplet Transfer
DOI: 10.1021/acsami.7b14410
Novel transient liquid phase bonding through capillary action for hightemperature power devices packaging
DOI: 10.1016/j.msea.2018.03.097
Modified pulse laser deposition of Ag nanostructure as intermediate for low temperature Cu-Cu bonding
DOI: 10.1016/j.apsusc.2018.03.076
Microstructure evolution and mechanical properties of Cu/Sn/Ag TLP-bonded joint during thermal aging
DOI: 10.1016/j.matchar.2018.07.041
Microstructure and Tensile-Shear Properties of Resistance Spot-Welded Medium Mn Steel
DOI: 10.3390/met8010048
Microstructure and mechanical properties of laser welded dissimilar joints between QP and boron alloyed martensitic steels
DOI: 10.1016/j.jmatprotec.2018.04.020
Microstructure and mechanical properties of fiber laser welded QP980 steel
DOI: 10.1016/j.jmatprotec.2018.02.015
Investigation of impact and spreading of molten nanosized gold droplets on solid surfaces
DOI: 10.1364/ao.57.002080
High Performance, Biocompatible Dielectric Thin-Film Optical Filters Integrated with Flexible Substrates and Microscale Optoelectronic Devices
DOI: 10.1002/adom.201800146
Hierarchically Mesostructured Aluminum Current Collector for Enhancing the Performance of Supercapacitors
DOI: 10.1021/acsami.8b03647
Effect of powders on microstructures and mechanical properties for Sn-Ag transient liquid phase bonding in air
DOI: 10.1007/s10854-018-9076-2
Ultrasound-Assisted Transient Liquid Phase Bonding of Magnesium Alloy Using Brass Interlayer in Air
DOI: 10.1016/j.jmst.2016.11.002
The Effects of Borides on the Mechanical Properties of TLPB Repaired Inconel 738 Superalloy
DOI: 10.1007/s11661-017-4243-2
Synthesis of silver nanoparticles using large-area arc discharge and its application in electronic packaging
DOI: 10.1007/s10853-016-0626-9
Rapid Ag/Sn/Ag transient liquid phase bonding for high-temperature power devices packaging by the assistance of ultrasound
DOI: 10.1016/j.ultsonch.2017.02.016
Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering
DOI: 10.1016/j.jallcom.2016.08.060
Nanoscale Wire Bonding of Individual Ag Nanowires on Au Substrate at Room Temperature
DOI: 10.1007/s40820-017-0126-8
Microstructure of diffusion-brazing repaired IN738LC superalloy with uneven surface defect gap width
DOI: 10.1080/13621718.2017.1290338
Microstructure characterization and mechanical behavior for Ag3Sn joint produced by foil-based TLP bonding in air atmosphere
DOI: 10.1016/j.msea.2016.10.092
Mechanism of Ag3Sn grain growth in Ag/Sn transient liquid phase soldering
DOI: 10.1016/s1003-6326(17)60080-3
Interfacial Structure and Formation Mechanism of Ultrasonic-assisted Brazed Joint of SiC Ceramics with Al-12Si Filler Metals in Air
DOI: 10.1016/j.jmst.2016.03.016
Interactions at the planar Ag3Sn/liquid Sn interface under ultrasonic irradiation
DOI: 10.1016/j.ultsonch.2017.05.042
Improving the electrical contact at a Pt/TiO2 nanowire interface by selective application of focused femtosecond laser irradiation
DOI: 10.1088/1361-6528/aa8150
Experimental and numerical study on local mechanical properties and failure analysis of laser welded DP980 steels
DOI: 10.1016/j.msea.2016.10.121
DP980 激光焊接温度场模拟及力学性能
Cu-Sn体系LTTLP连接接头强度与断口分析
带热障涂层的高温合金飞秒激光旋切打孔
DOI: 10.3788/cjl201744.0102013
Vacuum brazing of alumina to stainless steel using femtosecond laser patterned periodic surface structure
DOI: 10.1016/j.msea.2016.03.068
Ultrasonic-assisted brazing of Al-Ti dissimilar alloy by a filler metal with a large semi-solid temperature range
DOI: 10.1016/j.matdes.2016.01.109
Time-dependent wettability of nano-patterned surfaces fabricated by femtosecond laser with high efficiency
DOI: 10.1016/j.apsusc.2016.07.089
Sintering Bonding Process with Ag Nanoparticle Paste and Joint Properties in High Temperature Environment
DOI: 10.1155/2016/5284048
Plasmonic-Radiation-Enhanced Metal Oxide Nanowire Heterojunctions for Controllable Multilevel Memory
DOI: 10.1002/adfm.201601143
Plasmonic engineering of metal-oxide nanowire heterojunctions in integrated nanowire rectification units
DOI: 10.1063/1.4950963
Nanostructure of immiscible Mg-Fe dissimilar weld without interfacial intermetallic transition layer
DOI: 10.1016/j.matdes.2015.12.072
Microstructure, mechanical properties and mechanism of ultrasound-assisted rapid transient liquid phase bonding of magnesium alloy in air
DOI: 10.1016/j.matdes.2015.11.071
Microstructure and tensile behavior of fiber laser-welded blanks of DP600 and DP980 steels
DOI: 10.1016/j.jmatprotec.2016.05.011
Microstructure- and Strain Rate-Dependent Tensile Behavior of Fiber Laser-Welded DP980 Steel Joint (JMEP-15-07-8678.R1)
DOI: 10.1007/s11665-015-1864-8
Joining Mg alloys with Zn interlayer by novel ultrasonic-assisted transient liquid phase bonding method in air
DOI: 10.1016/j.matlet.2015.11.031
Investigation of splashing phenomena during the impact of molten sub-micron gold droplets on solid surfaces
DOI: 10.1039/c5sm00997a
Interfacial reaction and mechanical properties for Cu/Sn/Ag system low temperature transient liquid phase bonding
DOI: 10.1007/s10854-016-4366-z
In situ nanojoining of Y- and T-shaped silver nanowires structures using femtosecond laser radiation
DOI: 10.1088/0957-4484/27/12/125201
Effect of Precipitate Evolution on the Pitting Corrosion of Friction Stir Welded Joints of an Al-Cu Alloy
DOI: 10.5006/2049
Effect of nano-Al2O3 reinforcement on the microstructure and reliability of Sn-3.0Ag-0.5Cu solder joints
DOI: 10.1016/j.microrel.2016.03.005
Control of the kerfs size and microstructureinInconel 738 superalloy by femtosecond laserbeam cutting
DOI: 10.1016/j.apsusc.2016.02.162
Cold welding of Ag nanowires by large plastic deformation
DOI: 10.1016/j.scriptamat.2015.12.010
A comparative study of silver nanoparticles synthesized by arc discharge and femtosecond laser ablation in aqueous solution
DOI: 10.1007/s00339-016-0424-x
石英玻璃飞秒激光微连接及其接头性能
2219-T8铝合金搅拌摩 擦焊接头力学和应力腐蚀性能薄弱区研究
DOI: 10.11900/0412.1961.2015.00201
Thermal analysis of Cu-organic composite nanoparticles and fabrication of highly conductive copper films
DOI: 10.1016/j.jallcom.2015.07.248
Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic
DOI: 10.2320/matertrans.mi201406
Special Issue on Nanojoining and Microjoining II PREFACE
DOI: 10.2320/matertrans.mpr2015902
Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications
DOI: 10.1007/s40194-014-0216-x
SA508-Gr.3钢变参数回火焊道焊接接头组织与性能研究
Oxidation behavior of GTD111 Ni-based superalloy at 900 °C in air
DOI: 10.1016/j.corsci.2015.07.031
Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
DOI: 10.1021/acsami.5b02134
Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste near Room Temperature
DOI: 10.2320/matertrans.mi201412
Femtosecond laser-induced phase transformations in amorphous Cu77Ni6Sn10P7 alloy
DOI: 10.1063/1.4905588
Effects of Package Warpage on Head-in-Pillow Defect
DOI: 10.2320/matertrans.mi201404
Assembly of silver nanoparticles on nanowires into ordered nanostructures with femtosecond laser radiation
DOI: 10.1364/ao.54.002524
Annealing-induced highly-conductive and stable Cu-organic composite nanoparticles with hierarchical structures
DOI: 10.1016/j.jallcom.2015.02.144
石英玻璃与硅的飞秒激光微连接及其接头性能研究
DOI: 10.3788/cjl201542.0906004
飞秒激光参数对石英玻璃微孔加 工的影响
DOI: 10.3788/cjl201542.0403001
TIG焊工艺对LD10铝合金接头气孔的影响
Ag2O焊膏中添加镀银铜粉的低温烧结连接及其性能
两种TIG焊工艺对LD10接头力学性能的影响
封装体中枕头效应的翘曲模拟研究
Special Issue on Nanojoining and Microjoining PREFACE
DOI: 10.2320/matertrans.mpr2013903
Nano Brazing of Pt-Ag Nanoparticles under Femtosecond Laser Irradiation
DOI: 10.5101/nml.v5i2.p88-92
Metal-Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
DOI: 10.2320/matertrans.md201222
Mechanism of Low Temperature Sintering-Bonding through In- Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles
DOI: 10.2320/matertrans.md201231
Highly localized heat generation by femtosecond laser induced plasmon excitation in Ag nanowires
DOI: 10.1063/1.4790189
微米氧化银膏原位生成纳米银的低温烧结连接
铜基电磁开关触头材料抗熔焊性能研究
纳米银膏与微米银膏烧结连接对比研究
纳米金属颗粒膏合成及其低温烧结连接的电子封装应用研究进展
光束偏移量对钛/铝异种合金激光焊接接头组织和性能的影响
采用Sn-Bi钎料钎焊Bi2Te3基热电材料与无氧铜
The study of multiple thermal cycle of HTS YBCO bulk
DOI: 10.1016/j.physc.2011.12.007
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
DOI: 10.1016/j.scriptamat.2012.01.007
Polymer-Protected Cu-Ag mixed NPs for Low-Temperature Bonding application
DOI: 10.1007/s11664-012-2008-7
Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in Low Temperature Bonding Process with Silver Nanoparticles
DOI: 10.1007/s11664-012-1965-1
Effects of ion implantation on the brazing properties of high purity alumina
DOI: 10.1016/j.surfcoat.2011.09.034
Effect of PVP on the low temperature bonding process using polyol prepared Ag nanoparticle paste for electronic packaging application
DOI: 10.1088/1742-6596/379/1/012024
Crossed-wire Laser microwelding of Pt-10 Pct Ir to 316 low-carbon vacuum melted stainless steel: Part I. Mechanism of joint formation. Metall. Mater
DOI: 10.1007/s11661-011-0763-3
Crossed-wire laser microwelding of Pt-10%Ir to 316 LVW stainless steel Part II: Effect of orientation on joining mechanism.Metall. Mater
DOI: 10.1007/s11661-011-1003-6
纳米银与纳米铜混合焊膏用于电子封装低温烧结连接
Ti3Al激光焊接接头EBSD试样的制备
Ti3Al激光焊接接头组织与织构的EBSD分析
Preparation of polymer coated Cu NPs and its applications for Low-Temperature Bonding
DOI: 10.1039/c1jm12108a
Low Temperature Bonding of Cu Metal through Sintering of Ag Nanoparticles for High Temperature Electronic Application
DOI: 10.2174/1876531901103010070
Infuence of tool pin profile on the interface migration of friction stir lap joints
Fast Joining YBCO bulks with melt Ag doped Y-Ba-Cu-O solder
微连接和纳连接的研究新进展
YbBaCuO钎料钎焊高温超导块材
Soldering of Bi-2223/Ag high temperature superconducting tapes with Sn-Pb- Bi-Ag alloy paste
DOI: 10.1016/j.physc.2009.11.045
Loss of YBCO bulk superconducting ability at high temperatures and its recovery
DOI: 10.16511/j.cnki.qhdxxb.2010.02.025
Joining of textured YBCO with YBCO added Ag2O additive
DOI: 10.1016/j.physc.2010.04.002
Fast joining of melt textured Y-Ba-Cu-O bulks with high quality
DOI: 10.1016/j.physc.2010.05.236
Fabrication of Bi-223/Ag superconducting tapes with BSCCO superconducting powders by diffsuion bonding
DOI: 10.1016/j.physc.2010.03.007
Effects of Steel Coatings on Electrode Life in Resistance Spot Welding of Galvannealed Steel Sheets
DOI: 10.2320/matertrans.m2010239
Effect of post-weld heat treatment on microstructure and properties of Ti-23Al-17Nb alloy laser beam welding joints
DOI: 10.1016/s1003-6326(09)60206-5
Ag箔钎焊YBCO高温超导块材
添加超导中间层扩散连接BSCCO带材
钎焊YBCO高温超导块材研究
DOI: 10.13289/j.issn.1009-6264.2010.06.030
纳米银焊膏的烧结性能及其用于铜连接的研究
离子注入影响高纯氧化铝钎焊性能的研究
Superconducting joint of Bi-2223/Ag superconducting tapes by diffusion bonding
DOI: 10.1016/j.physc.2009.06.005
Study of air heat treatment on Bi-2223/Ag superconducting tapes
DOI: 10.1016/j.physc.2009.04.010
Fabrication of non-superconducting and superconducting joints of Ag/Bi-2223 tapes by diffusion bonding
Bi-2223/Ag高温超导带材的有阻连接研究
DOI: 10.3969/j.issn.1001-1382.2009.03.005
Bending Properties and Fracture Behavior of Ti-23Al-17Nb Alloy Laser Beam
DOI: 10.1016/s1007-0214(09)70043-4
A study on transient liquid phase diffusion bonding of Ti-22Al-25Nb alloy
DOI: 10.1016/j.msea.2007.11.104
直接扩散连接制备多芯Bi系超导带材超导接头
高2223相含量粉末扩散连接BSCCO带材
单畴钇系超导块材的扩散连接和钎焊技术
Ti2AlNb合金Ti-22Al-25Nb的TLP扩散连接研究
O相合金Ti-22Al-25Nb固态扩散连接研究
DOI: 10.19476/j.ysxb.1004.0609.2008.04.002
Formation process of the bonding joint in Ti/Al diffusion bonding
DOI: 10.1016/j.msea.2007.07.027
Diffusion bonding with a powder interlayer between Bi-Sr-Ca-Cu-O superconducting tapes
DOI: 10.1166/jctn.2008.830
高纯氧化铝与无氧铜的钎焊
06/TA2 diffusion bonding with Nb diffusion-retarding layers
DOI: 10.1016/j.matlet.2008.01.058
Ti/Al扩散焊接中的接头组织结构及其形成规律
Ti3Al基合金及其与异种材料的连接研究现状
Ti3Al合金激光焊接接头高温拉伸性能及显微组织
Ti3Al合金的发展现状及其连接技术
DOI: 10.16080/j.issn1671-833x.2007.06.001
LF6/TA2扩散焊接接头组织结构及性能
真空热处理对Al2O3陶瓷化学镀Ni-P膜及金属钎焊接头的影响
DOI: 10.13251/j.issn.0254-6051.2007.06.020
连接参数对Ti-22Al-25Nb合金TLP扩散连接接头性能的影响
DOI: 10.13846/j.cnki.cn12-1070/tg.2007.06.004
高铌含量Ti3Al基合金的扩散连接
DOI: 10.16511/j.cnki.qhdxxb.2007.11.019
高纯氧化铝与金属铌的活性钎焊
DOI: 10.16511/j.cnki.qhdxxb.2007.11.020
TiN改性钎料连接Si3N4陶瓷的接头高温性能
TiAl基合金连接研究述评
Improvements of the Si3N4 brazed joints with intermetallics
DOI: 10.1016/j.msea.2005.09.096
Bi-Sr-Ca-Cu-O高温超导材料的连接技术
DOI: 10.13251/j.issn.0254-6051.2006.06.001
塑性变形条件对扩散焊接头性能的影响
钼与石墨的扩散焊接
利用金属间化合物增强陶瓷钎焊接头
高纯氧化铝与金属钛的钎焊
Ti 对金属间化合物增强陶瓷钎焊接头组织与性能的影响
Reinforcement of ceramic bonded joints with intermetallic compounds-microstructures and interfacial reaction of joints
钎缝厚度对陶瓷连接接头强度的影响
利用金属间化合物增强陶瓷钎焊接头强度
利用金属间化合物增强陶瓷钎焊接头-接头组织与界面反应
金属轧制扩散复合技术基础研究
工艺参数对Bi系(BSCCO)超导带材扩散连接接头性能的影响
DOI: 10.13251/j.issn.0254-6051.2005.12.001
采用复合钎料钎焊Si3N4陶瓷
Ti和Ti/Ni/Ti连接钨与铜及其合金的界面结合机制与接头强度
Study on interface structure and bond properties between cemented carbide and tool steel blazing with amorphous alloy
Si3N4复相陶瓷半固态连接的接头组织与界面反应
DOI: 10.14136/j.cnki.issn1673-2812.2004.02.001
Joint strength with soldering of Al2O3 ceramics after Ni-P chemical plating
Ceramic bonding and the joint’s strengthening through forming intermetallic compounds in situ
原位生成法半固态连接Si3N4复相陶瓷的接头组织
DOI: 10.16511/j.cnki.qhdxxb.2004.05.010
以化学镀Ni-P为先导的陶瓷钎焊
韩征和,李明亚,顾晨. 以冷压为先导扩散连接高温超导带材
Diffusion bonding of tungsten to copper and its alloy with Ti foil and Ti/Ni/Ti multiple interlayers
Al/Ti/Al复合层原位生成金属间化合物连接陶瓷
基于B/S模式的远程焊接数值模拟系统
Microstructures and mechanical properties of Ti-24Al-17Nb (at.%) laser beam welding joints
DOI: 10.1016/s0966-9795(02)00049-3
Ag-Cu-Ti活性钎料真空钎焊钨、石墨与铜的研究
先进结构材料的发展及其钎焊连接技术的进展
DOI: 10.14136/j.cnki.issn1673-2812.2002.01.029
降低陶瓷与陶瓷或金属连接温度的技术
基于B/S结构的材料焊接咨询系统
DOI: 10.13846/j.cnki.cn12-1070/tg.2002.04.019
含金属间化合物的Al基合金半固态加压连接Si3N4陶瓷
DOI: 10.16511/j.cnki.qhdxxb.2002.11.004
大型电机转子焊接残余应力的数值分析
Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷与接头质量控制
Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷结合机理
DOI: 10.16511/j.cnki.qhdxxb.2001.z1.013
Ti-24Al-17Nb合金的激光焊接
Solid-liquid state pressure bonding of Si3N4 ceramics with aluminum based alloys and its mechanism
Heat resistant joints of Si3N4 ceramics with intermetallic compounds formed in situ
DOI: 10.1023/a:1017956611803
用Al-Ti和Al-Zr合金在大气中连接Si3N4陶瓷
热核聚变反应堆关键结构件的连接技术进展
DOI: 10.13846/j.cnki.cn12-1070/tg.2001.05.003
高Tc氧化物陶瓷超导材料的连接研究状况与展望
复合陶瓷挺柱钎焊变形及其控制
用Al-Zr和Al-V合金加压钎焊Si3N4陶瓷
DOI: 10.13846/j.cnki.cn12-1070/tg.2000.02.001
耐高温陶瓷接头的合金化——用Al/Ti/Al复合层连接Si3N4陶瓷
耐高温陶瓷接头的合金化-用Al/Ni/Al复合层连接Si3N4陶瓷
连接压力在Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷中的作用机制
金属间化合物提高陶瓷接头高温性能的作用
复合陶瓷挺柱的钎焊质量控制
DOI: 10.14158/j.cnki.1001-3814.2000.03.012
Al及其合金作钎料或中间层连接陶瓷-金属
用Al-Ti合金加压钎焊Si3N4陶瓷及接头高温性能
耐高温陶瓷-金属连接研究的现状及发展
含Al、Ti、Zr的活性合金连接陶瓷时的防氧化
DOI: 10.13846/j.cnki.cn12-1070/tg.1999.03.001
取消10CrMo910钢厚壁管接头焊后热处理的研究
DOI: 10.19666/j.rlfd.1996.03.003